TEQIP - III Sponsored

International Conference on

Microwave Integrated Circuits, Photonics and Wireless Networks (IMICPW-2019)

22nd To 24th, May 2019


Call for Papers

The purpose of the conference is to provide a forum for presentation and discussion of emerging technology on Microwave Integrated Circuits, Photonics and Wireless Network particular, but not limited

Track I

  • S1: Passive Microwave Components and Circuits:

    • Planar transmission lines, couplers, dividers/combiners, hybrids, lumped-element circuits, tunable planar components and devices, Planar Filters and Multiplexers, couplers dividers/combiners, hybrids, tunable components and devices, tunable filters

  • S2: Planar Filters and Multiplexers:

    • Innovative synthesis and analysis, active filters, 3D filters and multiplexers, non-planar integrated technologies (LTCC, Liquid Crystal Polymer, MCM-Deposition)

  • S3: Active Components, Circuits and Subsystems:

    • Low Noise Circuits and Modules, LNA, detectors, Frequency Generation, Conversion and Control circuits, mixers, frequency multipliers/dividers, Front-End and Transceiver Modules, System-in-Package

  • S4: Microwave systems and application:

    • Microwave imaging, Terahertz based system, biological and medical applications of Microwaves, Wireless power transfer, RF energy harvesting.

  • S5: Printed periodic structures:

    • Metamaterials, Frequency Selected Surfaces and Electromagnetic Bandgap Structures Components, circuits and systems using metamaterials, frequency selected surfaces and electromagnetic band gap structures

  • S6: Antennas and propagation:

    • Antenna Design and Characterization, Modelling, calibration and measurements, antenna systems, multiple polarizations, multiple beams, Active antennas, reconfigurable antennas

  • S7: Antenna for various application:

    • RFID Antenna, UWB antenna, Special type antennas such as Wearable antennas, Implantable antennas etc.

Track II

  • Optical Communication and Networks
  • Optical Sensors
  • Optoelectronic Materials & Device
  • Nanophotonics
  • Li – Fi
  • Optical wireless communicatio
  • Biophotonics
  • Optoelectronic devices and integration
  • Light emitting and lasing
  • Coherent optics
  • Ultrafast optics
  • Light harvesting
  • Linear & Nonlinear Optic
  • Silicon Photonics
  • Optical computing
  • Optical signal processing and Imaging
  • Plasmonics
  • Green Photonics
  • Optical Transceivers
  • IC Design for Optical Communication
  • Circuit Design for Optical Communication
  • TIA Design for Optical Communication
  • Optical Networks

Track III

  • RF and wireless communication
  • Millimeter Wave Communications
  • Massive MIMO
  • Full-duplex radios for 5G and beyond mobile communications
  • Multiple access/modulation schemes beyond OFDMA (FBMC, GFDM, NOMA, etc.)
  • Molecular, Biological, and Multi-Scale Communications
  • Measurements and Simulations in Channel Modelling in Wireless Body Area Networks
  • Wireless Sensor Networks (WSNs)
  • Software-defined mobile/wireless networks
  • Sensor and Adhoc networks
  • Routing in wireless networks
  • Cognitive radio and networking
  • Resource management and optimization
  • Big Data enabled Self-Organized Networking
  • Mobile big data and network data analytics
  • Smart Grid Communications
  • Heterogeneous wireless network
  • Energy harvesting wireless communication technologies
  • Device-to-device/machine-to-machine communications
  • Tactile internet applications & IoT
  • Satellite and Space Communications
  • VLSI for Wireless Application
  • RF/Analog circuits for Wireless Applications
  • Wireless Transceiver
  • Low Power circuits for IoT Applications
  • Low Power circuits for Portable/Wearable Wireless Devices
  • Digital IC design for wireless applications.
  • Signal processing for wireless standards
  • Novel Electron device modelling for future Wireless standards
  • 5G Wireless Networks and Applications
  • ICs for 5G Wireless Communication (Analog/Digital)